Epoxy Resin-Bonding fixation - Metal + Glass、Thermoset plastics


Epoxy

Bonding fixation - Metal + Glass、Thermoset plastics


Principle Applicable

The chemical structure is soft and tough rubber material which can resist the expansion and contraction pulling of different materials.


Adhesive application

LED light source module, micro transformer, mode fiber connector


One Component

Product No.

JC180-3

JC750

JB542

JC315-3

Product Description

Substrate

PC , AL

LCP, PC, AL

SS , PC

FE, AL

Features

Thermal Shock Resistance

Low Temprature Cure

SoftHigh Tenacity

High Temperature Resistance
Strength

Appearance

White

Black

White

Gray

Viscosity(cps) / Ti

150,000~270,000 / 1.8~3

30,000~ 50,000 / 3~4

28,000~40,000 / >2

140,000~220,000 / >4

Pot Life @ 25°C

3days

7days

7days

7days

Curing Condition

70C/60min
80
°C/30min

70°C/45min
80
°C/30min

100°C/60min
120
°C/40min

150°C/30min

Tg()

80

30

31

126

CTE ppm(<TG)/ppm(>TG)

30 / 150

47 / 225

95/229

59 / 200

Hardness (SHORE)

D85

D77

D75

D84

Water Absorption Ratio
(25
°C/24hr)(%)

0.03

0.43

1.1

0.3

Shear Strength(kgf/cm2)

Al vs. Al, 114

Al vs. PC, 87

SUS vs. PC , 135

Al vs. Al, 493

Surface Resistivity,( ohm)
Volume Resistivity, (ohm-cm)

4.5*1015 4.5*1014

5*1015 5*1014

4.5*1015 4.5*1014

4.5*1015 4.5*1014

Dielectric Constant( 1KHz )

3.2

4.1

3.2

3.3

Temperature Range()

-20°C~100°C

-40°C~120°C

-40°C~100°C

-30°C~150°C

Storage / Shelf Life

-20°C / 8Months

-20°C / 8Months

2~13°C / 12Months

-20°C / 8Months




Two Component

Product No.

JA484-3AB

JB416-3AB

JA484-21AB

Product Description

Substrate

FE, PC

AL, PC

FE, PC

Features

Rapid Cure

Non-Flowing
Rapid Cure

Rapid Cure

Appearance

A:Colorless Liquid
B:Light YellowClear

A:Colorless Liquid
B:Light YellowClear

A:White
B:White

Viscosity(cps) / Ti

A: 15,000~ 23,000
B: 9,000~ 15,000

A: 100,000~ 200,000 / 3.25
B: 19,000~ 36,000 / 3.9

A: 110,000~ 190,000 / 3
B: 145,000~ 220,000 / 3

Mix Ratio

1:1

1:1

1:1

Pot Life @ 25°C

3min

3min

10min

Curing Condition25°C
Surface Dry Time / Through Cure Time

13min / 3days

25°C / 5~10min
25
°C / 3~4days

13~15min /3days

Tg()

52

49

25

CTE ppm(<TG)/ppm(>TG)

55 / 218

46 / 223

38 / 247

Hardness (SHORE)

D84

D85

D70

Water Absorption Ratio
(25
°C/24hr)(%)

2.6

1.26

2.46

Shear Strength(kgf/cm2)

Al vs. Al, 207

Al vs.PC, 165

Al vs. Al, 154

Dielectric Strength( KV/mm)

19

18

19

Temperature Range()

-20 ~ 100

-20 ~ 100

-20 ~ 100

Package

50ml Syringe, 1kg, 20kg

50ml Syringe, 1kg, 20kg

50ml Syringe, 1kg, 20kg


Product No.

JA484-23AB

JC056-1AB

Product Description

Substrate

FE, PC

AL,Epoxy

Features

Rapid Cure

High Tenacity

Appearance

A:Black
B:Light Yellow

A:Black
B:Yellow

Viscosity(cps) / Ti

A: 10,400~ 15,600
B: 9,600~ 14,400

A: 30,000~ 60,000 / 4.3 B: 20,000~ 36,000

Mix Ratio

1:1

2:1

Pot Life @ 25°C

3min

20min

Curing Condition25°C
Surface Dry Time / Through Cure Time

13min / 3days

2hr / 80C*60min , 5-7days

Tg()

52

73

CTE ppm(<TG)/ppm(>TG)

76 / 218

115 / 204

Hardness (SHORE)

D84

D84

Water Absorption Ratio
(25
°C/24hr)(%)

2.6

0.42

Shear Strength(kgf/cm2)

Al vs. Al, 207

Al vs. Al, 297

Dielectric Strength( KV/mm)

19

20

Temperature Range()

-30 ~ 100

-30 ~ 120

Package

50ml Syringe, 1kg, 20kg

50ml Syringe, 1kg, 20kg